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Автор: Suny Li (Li Yang)
Издательство: Wiley
Год: 2017
Формат: PDF
Размер: 88 Мб
Язык: английский / English
Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.