
Автор: Editor: Tejinder Gandhi
Издательство: ASM International
Год: 2019
Формат: True PDF
Страниц: 718
Размер: 96.9 Mb
Язык: English
This edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. Topics include: Failure Analysis Process and Management wafer, package, and board level failure analysis flow. Incoming Inspection Tools optical, x-ray, and scanning acoustic microscopy.