Название: Theory and Practice of Thermal Transient Testing of Electronic ComponentsАвтор: Marta Rencz, Gabor Farkas, Andras Poppe
Издательство: Springer
Год: 2023
Страниц: 389
Язык: английский
Формат: pdf (true)
Размер: 15.5 MB
This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
Thermal transient measurements have become the most important characterization method of the thermal behavior of electronic systems in the last decades. This development is mainly due to the emergence of a new methodology, the structure function method, which is based on the network identification by deconvolution, introduced by V. Szekely. This methodology in its mature form offers a “look inside the structure” of an electronic component with a single electrical measurement and the subsequent automated evaluation in software. It helps reveal data about the partial thermal resistances and capacitances inside the structure at all levels of an assembly, starting at a chip in a device package or module, through thermal interface and other material layers and various cooling mounts. The method may even provide temperature data on internal surfaces in the heat-conducting path which are otherwise not accessible for temperature measurements.
The users of the method soon understood that it is not pure magic, and to be able to fully exploit the capabilities of the methodology, a large amount of advanced knowledge is needed about the operation and the structure of the devices that are tested. In this book the authors, who are electrical engineers and university professors, tried to collect all information that is needed to fully understand the capabilities and the specialties of the thermal transient measurement technique.
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