Название: More-than-Moore Devices and Integration for SemiconductorsАвтор: Francesca Iacopi, Francis Balestra
Издательство: Springer
Год: 2023
Страниц: 271
Язык: английский
Формат: pdf (true), epub
Размер: 50.54 MB
This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems.
The term “More-than-Moore” appeared and was readily adopted by the semiconductor community since the early 2000s, when, in addition to the decades-long focused effort to scale down the footprint of logic and memory devices according to the well-known Moore’s Law, an orthogonal trend in electronics miniaturisation had started to gain momentum.
In contrast to the aggressive pursuit of increasingly more powerful computing led by Moore’s Law (More Moore), the More-than-Moore trend focuses on the combination of an increasing number of functionalities within a miniaturised system. One of the main application drives for More-than-Moore had clearly been the pursuit of smart portable systems, with smartphones being one of the consumer applications spearheading this new trend. While smart portable devices in the late 1990s and early 2000s were still at a very early stage of development, mainly focused on mobile computing functionalities such as palm-sized PCs and using rudimentary connectivity and awkward user interfaces, the launch of the first Apple iPhone model – among the first wave of truly multifunctional portable smartphones, precursor to today’s ubiquitous technologies – took place not too long afterwards, in 2007. The opportunity for such an extraordinary leap of smart systems with increasing complexity, number of functionalities and autonomy, all within an increasingly small form factor (More-than-Moore trend), has originated out of the simultaneous convergence of several key technologies, including the evolution of the following:
1. Mobile communications, particularly digital cellular networks, also thanks to the development of ICs for wireless communications, including power MOSFET and RF ICs.
2. Integrated power sources and energy-harvesting systems, key to ensuring autonomy.
3. Low-power ICs, specifically developed for mobile applications.
4. User interfaces such as advanced touchscreen technologies.
5. The availability of an increasing number of miniaturised functionalities, starting from the historically more advanced ones, such as digital CMOS cameras, MEMS technologies for sensors and actuators (loudspeakers, microphones, gyroscopes, etc.) and optoelectronics (LEDs, etc.)
The field of flexible, printed and organic electronics has progressed enormously in the last years. Printed electronics is one of the most promising fields in electronics. It is based on creating electronic devices by printing on a variety of substrates, some of them being flexible. Inks for printed electronics are usually made of carbon-based compounds. In particular, inkjet printed electronics has progressed very fast during the last years, and nowadays inkjet printers are capable of printing electrical circuits very quickly and inexpensively. At an industrial level, high-quality printed electronics are already being used to produce flexible keyboards, conformable antennas, flexible screens, interactive books and posters, electronic skin patches and more with industrial processing such as flexography or screen printing. Indeed, there are already a high number of printed electronics products in the market. Some of the latest progress in printed electronics were the smart packaging, ranging from RFID labels to RFID sensing labels. The market for printed electronics is growing because the Internet of Things is expanding and require slow-cost, lightweight technology that can sense and store information securely and transmit data.
- Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems;
- Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources;
- Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.
Contents:
1. Energy Harvesters and Power Management
2. SiC and GaN Power Devices
3. Flexible and Printed Electronics
4. Terahertz Metasurfaces, Metawaveguides, and Applications
5. Mechanical Robustness of Patterned Structures and Failure Mechanisms
6. Neuromorphic Computing for Compact LiDAR Systems
7. Integrated Sensing Devices for Brain-Computer Interfaces
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