Название: Advanced Flip Chip PackagingАвтор: Ho-Ming Tong, Yi-Shao Lai
Издательство: Springer
Год: 2013
Формат: PDF
Размер: 21 Мб
Язык: английский / English
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.